Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material
Reexamination Certificate
2006-04-25
2006-04-25
Geyer, Scott (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
C029S829000
Reexamination Certificate
active
07033917
ABSTRACT:
A packaging substrate without plating bar and a method of forming the same is provided. A substrate is firstly provided with circuit patterns formed thereon. Then, solder masks are formed to define connecting points on the circuit patterns. Afterward, the openings of the solder mask on a bottom surface of the substrate are filled with solder material. Thereafter, a seed layer is formed on the bottom surface of the solder mask and the solder material, and then a passivation layer is formed on a surface of the seed layer. Finally, a plating process is carried out by using the seed layer to input cathode electric level to form metal pads on the defined connecting points on the upper surface of the substrate.
REFERENCES:
patent: 6739048 (2004-05-01), Jones et al.
Ho Kwun-Yao
Kung Moriss
Geyer Scott
Via Technologies Inc.
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