Packaging substrate structure and manufacturing method thereof

Details Packaging substrate structure and manufacturing method thereof Packaging substrate structure and manufacturing method thereof

2008-06-27

2011-11-15

Vortman, Anatoly (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C029S852000, C361S748000

Reexamination Certificate

active

08058566

ABSTRACT:
A packaging substrate structure includes a dielectric layer with a plurality of dielectric pillars disposed on a portion of a large-dimension opening area of the dielectric layer; and a first circuit layer with a plurality of first circuits disposed on a portion of the dielectric layer, and a conductive block disposed in the large-dimension opening area of the dielectric layer having the dielectric pillars. The dielectric pillars reduce the difference of the electrical current density distribution between the large-dimension opening area and small-dimension opening areas during electroplating, thereby overcoming the conventional drawback of insufficient thickness or a hollow center of the conductive block that results in an uneven thickness of the circuit layer. The invention further provides a method of manufacturing the packaging substrate structure.

REFERENCES:
patent: 5869880 (1999-02-01), Grill et al.
patent: 6562657 (2003-05-01), Lin
patent: 7050304 (2006-05-01), Hsu et al.
patent: 7239525 (2007-07-01), Hsu
patent: 7242092 (2007-07-01), Hsu
patent: 7539022 (2009-05-01), Hsu
patent: 7592706 (2009-09-01), Hsu
patent: 7656040 (2010-02-01), Hsu et al.
patent: 2002/0189853 (2002-12-01), Hsu
patent: 2006/0043549 (2006-03-01), Hsu
patent: 2006/0060557 (2006-03-01), Sreenivasan et al.
patent: 2007/0045784 (2007-03-01), Corisis et al.
patent: 2007/0246744 (2007-10-01), Chen et al.
patent: 2008/0185704 (2008-08-01), Hsu et al.
patent: 2005064498 (2005-03-01), None
patent: 2007214534 (2007-08-01), None

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