Packaging substrate having pattern-matched metal layers

Details Packaging substrate having pattern-matched metal layers Packaging substrate having pattern-matched metal layers

2011-03-08

2011-03-08

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S122000, C438S618000, C257SE23175

Reexamination Certificate

active

07901998

ABSTRACT:
A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished.

REFERENCES:
patent: 4736521 (1988-04-01), Dohya
patent: 4963697 (1990-10-01), Peterson et al.
patent: 5162240 (1992-11-01), Saitou et al.
patent: 5414637 (1995-05-01), Bertin et al.
patent: 5451721 (1995-09-01), Tsukada et al.
patent: 6217987 (2001-04-01), Ono et al.
patent: 6376049 (2002-04-01), Asai et al.
patent: 6392898 (2002-05-01), Asai et al.
patent: 6410858 (2002-06-01), Sasaki et al.
patent: 6411519 (2002-06-01), Asai et al.
patent: 6591495 (2003-07-01), Hirose et al.
patent: 6724638 (2004-04-01), Inagaki et al.
patent: 6845497 (2005-01-01), Murai et al.
patent: 7535095 (2009-05-01), En et al.
patent: 7682972 (2010-03-01), Hurwitz et al.

Affiliated with

Also associated with

Rating

Packaging substrate having pattern-matched metal layers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packaging substrate having pattern-matched metal layers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging substrate having pattern-matched metal layers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2663018