Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate
2011-06-07
2011-06-07
Lam, Cathy (Department: 1784)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Solder wettable contact, lead, or bond
C257S780000, C257S781000, C257S753000, C257S759000, C257S762000, C257S766000
Reexamination Certificate
active
07956472
ABSTRACT:
A packaging substrate having an electrical connection structure and a method for fabricating the same are provided. The packaging substrate have a substrate body with a plurality of conductive pads on a surface thereof; a solder mask layer disposed on the substrate body with a plurality of openings corresponding to the conductive pads, the size of each of the openings being larger than each of the conductive pads; and electroplated solder bumps for covering the conductive pads to provide better bond strength and reliability.
REFERENCES:
patent: 3986255 (1976-10-01), Mandal
patent: 6198169 (2001-03-01), Kobayashi et al.
patent: 6548898 (2003-04-01), Matsuki et al.
patent: 6664128 (2003-12-01), Tong et al.
patent: 6717059 (2004-04-01), Shintani et al.
patent: 6767819 (2004-07-01), Lutz
patent: 7081402 (2006-07-01), Hsu et al.
patent: 7151050 (2006-12-01), Hsu et al.
patent: 7199036 (2007-04-01), Chan et al.
Lam Cathy
Schmeiser Olsen & Watts LLP
Unimicron Technology Corp.
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