Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-11-07
2006-11-07
Cao, Phat X. (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S120000
Reexamination Certificate
active
07132310
ABSTRACT:
A basic portion layer21of a substrate electrode12aconnected to a projecting electrode13electrically and mechanically on a substrate member of ceramics. The substrate member on which the basic portion layer21is formed is subjected to sintering. A surface of the basic portion layer21in the sintered substrate member is polished. On the polished basic portion layer21, the plating layers22, 23are formed, so that surface roughness of the substrate electrode12amay be, for example, not larger than 0.1 μmRMS. Accordingly, junction strength of an integrated circuit element mounted on a packaging substrate by a flip-chip method can be improved.
REFERENCES:
patent: 5241133 (1993-08-01), Mullen et al.
patent: 5901041 (1999-05-01), Davies et al.
patent: 5939772 (1999-08-01), Hurst et al.
patent: 5991989 (1999-11-01), Onishi et al.
patent: 6392294 (2002-05-01), Yamaguchi
patent: 6437439 (2002-08-01), Shimoe
patent: 6518501 (2003-02-01), Kawahara et al.
patent: 6780682 (2004-08-01), Pendse
patent: 2004/0108560 (2004-06-01), Taga
Gunji Katsuhiko
Nakano Masahiro
Oikawa Yasunobu
Sato Katsuo
Cao Phat X.
McGinn IP Law Group PLLC
TDK Corporation
LandOfFree
Packaging substrate and manufacturing method thereof,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Packaging substrate and manufacturing method thereof,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging substrate and manufacturing method thereof,... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3684743