Packaging structure of a semiconductor device

Details Packaging structure of a semiconductor device Packaging structure of a semiconductor device

1991-10-18

1994-04-12

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257778, 257786, 257797, H01L 2302

Patent

active

053028546

ABSTRACT:
The present invention comprises the steps of electrically connecting at least one pair of bumps on a semiconductor device, bringing the bumps into contact with a surface of the packaging substrate and moving the semiconductor device relative to the packaging substrate while monitoring whether at least one pair of electrode terminals formed on the surface of the packaging substrate are electrically connected to each other, positioning the semiconductor device with respect to the packaging substrate at a position where the electrode terminals whose electrical connection is monitored are electrically connected to each other, and packaging the semiconductor electrode on the packaging substrate.

REFERENCES:
patent: 3984860 (1976-10-01), Logue
patent: 4021838 (1977-05-01), Warwick
patent: 4721365 (1988-01-01), Nishimura
patent: 4817849 (1989-04-01), Yamamoto
patent: 4924589 (1990-05-01), Leedy
patent: 4970780 (1990-11-01), Suda et al.

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