Packaging structure integrating passive devices

Details Packaging structure integrating passive devices Packaging structure integrating passive devices

2002-02-15

2004-03-30

Chambliss, Alonzo (Department: 2827)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257S531000, C257S532000, C257S670000, C257S672000, C257S676000, C257S690000, C257S724000, C257S783000, C257S784000, C361S723000, C361S766000, C361S767000, C361S773000, C361S776000, C361S813000

Reexamination Certificate

active

06713836

ABSTRACT:

CROSS-REFERENCE TO RELATED APPLICATION
This application claims the priority benefit of Taiwan application serial no. 90115213, filed Jun. 22, 2001.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to a packaging structure. More particularly, the present invention relates to a leadframe packaging structure that integrates passive devices.
2. Description of the Related Art
To eliminate negative electrical effects such as electro-magnetic interference or undesirable coupling between leads in a leadframe packaging structure, passive devices are conventionally arranged on the leadframe of the leadframe packaging structure.
Referring to
FIG. 1
, a top view schematically illustrates a conventional leadframe structure used in packaging structures that integrate passive devices. At a central chip-bonding region
102
of the leadframe
100
, a die pad
104
is conventionally arranged to carry a chip
106
. Tie bars
108
are arranged around the die pad
104
as support elements to prevent warping of the die pad
104
during an encapsulating process. The leadframe
100
further comprises leads
110
around the die pad
104
and dam bars
116
. The dam bars
116
define an encapsulating region
117
by separating the leads
110
into inner leads
112
and outer leads
114
.
FIG. 2
is an enlarged view of the region
118
shown in FIG.
1
. As shown in
FIG. 2
, two adjacent inner leads
112
a
are conventionally extended to form a contact pad
120
. Supported by two leads
112
a
, the contact pad
120
is more rigid. Furthermore, a peripheral portion of the die pad
104
extends outwardly to provide another contact pad
122
. A passive device
124
thereby can be conventionally mounted between and electrically connects the contact pads
120
,
122
. The leadframe thus arranged can integrate a passive device within a packaging structure to improve the electrical proprieties of the packaging structure.
However, because the space between the die pad and inner leads of the conventional leadframe is limited, the possibility of passive device arrangement on the conventional leadframe is also limited. Such a space limitation allows for a decoupling of only two adjacent leads and more distant leads cannot be decoupled.
SUMMARY OF THE INVENTION
An aspect of the present invention is to provide a leadframe packaging structure that integrates passive devices and overcomes the above problems by rearranging the leadframe structure.
To attain at least the foregoing objectives, a packaging structure integrating passive devices comprises, according to an embodiment of the present invention, a leadframe, a chip, at least a passive device, and an encapsulant material. The leadframe comprises a plurality of first leads that define a chip-bonding region within the leadframe. A die pad is arranged in the chip-bonding region. The chip is bonded on the die pad. A plurality of second leads extends and terminates in a plurality of contact pads in the chip-bonding region. An adhesive tape may be bonded onto bottom surfaces of the contact pads. At least a passive device is mounted between and electrically connects the contact pads. A plurality of bonding wires electrically connects the chip, the passive device, and the first and second leads to one another. The encapsulant material encapsulates the chip, the bonding wires and the passive device, and leaves an outer portion of the leads exposed.
It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed.


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