Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-12-19
2000-01-11
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361707, 361712, 361713, 361715, 361716, 361721, 361790, 257686, 174 163, H05K 720
Patent
active
060143134
ABSTRACT:
A three-dimensional multi-chip module is formed as a stack of two-dimensional multi-chip modules comprising substrates which have electrically signal paths connecting integrated circuit chips and has vertical interconnections of the signal paths, provided by interconnection or via chips. The individual chips or other inner components on a substrate are in mechanical contact with a surface of an adjacent substrate and constitute the distance device maintaining the substrates spaced from each other. Thus heat developed in components can be conducted essentially perpendicularly to the substrates. Thermally conducting chips can be used for improving the conducting of heat. Cooling devices are located only at the top and bottom surfaces of the stack. Channels are formed between the chips and components which can be used for cooling and furthermore spaces are formed at the edges of the substrates in which electrical connectors can be inserted for coupling the stack to a similar stack, since there are no cooling devices at the lateral surfaces of the stack. The components of the stack is maintained in a detachable manner in electrical and mechanical contact with each other by applying a compressive force and by using elastic connecting and guiding devices. In particular bumps can be arranged cooperating with edge surfaces of components to guide components to correct positions.
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Chervinsky Boris C.
Picard Leo P.
Telefonaktiebolgey LM Ericsson
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