Packaging structure and process of electronic card

Details Packaging structure and process of electronic card Packaging structure and process of electronic card

2006-05-23

2006-05-23

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S123000, C361S737000

Reexamination Certificate

active

07049172

ABSTRACT:
A packaging process of an electronic card is provided. Firstly, a first embedding operation is performed to embed a first metal cover into a first surface of a plastic frame. Then, a circuit board is placed on the plastic frame. Afterward, a second embedding operation is performed to embed a second metal cover into a second surface of the plastic frame. The circuit board is encapsulated into the plastic frame so as to form an electronic card package. The first metal cover, the plastic frame and the second metal cover are separately formed.

REFERENCES:
patent: 5355837 (1994-10-01), Reyes
patent: 5397857 (1995-03-01), Farquhar et al.
patent: 6337797 (2002-01-01), Huang

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