Packaging structure and packaging method of electronic...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S255000, C174S262000, C361S749000, C029S835000

Reexamination Certificate

active

11049901

ABSTRACT:
An electronic part mounting structure includes a printed circuit board, a plurality of electronic parts mounted on the printed circuit board, a folded portion of the printed circuit board bent and layered between the electronic parts, through holes formed in both sides of the folded portion, and a wiring connecting the electronic parts via the through holes and connecting the electronic parts to the through holes.

REFERENCES:
patent: 5224023 (1993-06-01), Smith et al.
patent: 5363275 (1994-11-01), Frankeny et al.
patent: 5742480 (1998-04-01), Sawada et al.
patent: 6208521 (2001-03-01), Nakatsuka
patent: 6908792 (2005-06-01), Bruce et al.
patent: 5-8969 (1993-02-01), None
patent: 6-7265 (1994-01-01), None
patent: 10-326970 (1998-12-01), None
patent: 11-17288 (1999-01-01), None
patent: 2001-244667 (2001-09-01), None
patent: 2001-244669 (2001-09-01), None
patent: 2001-288667 (2001-09-01), None
patent: 2002-171069 (2002-06-01), None

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