Metal working – Method of mechanical manufacture – Electrical device making
Patent
1991-08-30
1993-06-01
Eley, Timothy V.
Metal working
Method of mechanical manufacture
Electrical device making
29844, 29856, 26427215, 26427217, 437211, 257735, H01L 2166, H05K 330
Patent
active
052148467
ABSTRACT:
A semiconductor device is fabricated by placing a semiconductor chip in a lead frame which has no die pad. Electrodes of the chip are connected by bonding wires to respective lead fingers. Additionally, the lead frame has movement restricting fingers which limit horizontal movement of the chip within the lead frame during injection of resin into a mold surrounding the chip. Furthermore, the mold has horizontal movement restricting projections to limit vertical movement of the chip within the mold cavity. The restriction on horizontal and vertical movement of the chip reduces the risk of the bonding wires being broken or short circuited during the resin injection process.
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Asami Yukio
Fukasawa Hiroyuki
Kojima Akira
Eley Timothy V.
Sony Corporation
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