Packaging of high power semiconductor lasers

Details Packaging of high power semiconductor lasers Packaging of high power semiconductor lasers

1997-04-07

1998-06-23

Picardat, Kevin

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

438 28, 438116, H01L 2100

Patent

active

057704732

ABSTRACT:
A package for a high power semiconductor laser comprising a hermetically sealed container filled with a dry gaseous medium containing oxygen. The presence of oxygen in the laser atmosphere is counter to standard practice in the art which teaches the use of an atmosphere of a dry inert gas. The package also includes a getter for organic impurities, e.g., a getter composed of a porous silica or a zeolite. The hydrogen content of the materials used to form the package are reduced by baking at an elevated temperature for an extended period of time, e.g., at 150.degree. C. for 200 hours.

REFERENCES:
patent: 3576474 (1971-04-01), Huber et al.
patent: 3810044 (1974-05-01), Woodbury et al.
patent: 4553020 (1985-11-01), Val
patent: 4563368 (1986-01-01), Tihanyi
patent: 4631267 (1986-12-01), Lachman et al.
patent: 4631731 (1986-12-01), Wolter et al.
patent: 4656638 (1987-04-01), Tihanyi et al.
patent: 4769345 (1988-09-01), Butt et al.
patent: 4980137 (1990-12-01), Nelson et al.
patent: 5058124 (1991-10-01), Cameron et al.
patent: 5144634 (1992-09-01), Gasser et al.
patent: 5392305 (1995-02-01), Jakobson
patent: 5513198 (1996-04-01), Jakobson
Encyclopedia of Applied Physics, vol. 8, "Laser Physics" Kelley et al., 1994, pp. 299,303,307.
Philipp Schuessler and Stephen G. Gonya, "Hydrogen Desorption From Base and Processed Packaging Alloy", RL/NIST Workshop on Moisture Measurement and Control for Microelectronics, Gaithersburg, MD, Apr. 5-7, 1993.
"Requirement to Avert Packaging Induced Failure (PIF) of High Power 980 nm Laser Diodes", by Jakobson et al, published at LEOS, Nov. 1993.
"Military Standard--Certification Requirements For Hybrid Microcircuit Facilities and Lines", published in Statement Approved for Public Release, 15 May 1987 Department of Defense. MIL-STD-1772A.
"Considerations in the Hermetic Packaging of Hybrid Microcircuits" by Marjorie Byrnes, Jerry Carter, Jerry Sergent, and Dennis King in Solid State Technology publication, Aug. 1984, pp. 183-186.
"Analysis of Rapid Degradation in High-Powered (AlGa) As Laser Diodes" by William J. Fritz published in IEEE Journal of Quantum Electronics, vol. 26, No. 1, Jan. 1990, pp. 68-74.
Guch et al, "Beyond Perfection: The Need for Understanding Contamination Effects on Real-World Optics", preprint from Oct. 27, 1993 Boulder Conference on Laser Packaging (Laser Systems Division of Litton Systems, Inc.).
Hovis et al, "Optical Damage at the Part Per Million Level: The Role of Trace Contamination in Laser Induced Optical Damage", overheads preprint from Oct. 27, 1993 Boulder Conference on Laser Packaging (Laser Systems Division of Litton Systems, Inc.).
Ishikawa et al, "Outgassing Rate of Some Austenitic Stainless Steels", J. Vac. Sci. Technolog. A., 9:250-253, 1991.
Kenchington et al, "Oxygen Addition to the Annulus Gas Systems of Pickering NGS A, Units 3 and 4", Proceedings of the 10th Annual Conference of the Canadian Nuclear Society 3-1-3-5 1989.
Schuessler et al, "The Effects of Hydrogen on Device Reliability: and Insights on Preventing These Effects", Hybrid Circuit Technology, 8:19-26, 1991.
R. Szostak, "Handbook of Molecular Sieves", 1992 Van Nostrand Reinhold, pp. 92, 93, 117, 168, 169, 258, 278, 279, 284, 285, 343, 377, 393, 518,.
J. S. Beck et al, "A New Family of Mesoporous Molecular Sieves Prepared With Liquid Crystal Templates", 1992 American Chemical Society, pp. 10834-10843.
Michael E.Leonowicz et al, "MCM-22: A Molecular Sieve With Two Independent Multidimensional Channel Systems", Science, vol. 264, 24 Jun. 1994, pp. 1910-1913.

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