Packaging of electronic chips with air-bridge structures

Details Packaging of electronic chips with air-bridge structures Packaging of electronic chips with air-bridge structures

2008-06-17

2008-06-17

Graybill, David E (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including contaminant removal or mitigation

C438S599000, C438S619000, C438S623000, C438S666000, C438S669000, C438S687000, C438S977000

Reexamination Certificate

active

07387912

ABSTRACT:
A circuit assembly for fabricating an air bridge structure and a method of fabricating an integrated circuit package capable of supporting a circuit assembly including an air bridge structure. A circuit assembly comprises an electronic chip and a conductive structure embedded in a plurality of materials having a plurality of vaporization temperatures. The plurality of materials is formed on the electronic chip and the conductive structure is coupled to the electronic chip. To fabricate the circuit assembly, a support structure, including interstices, is formed on an electronic chip. The interstices of the support structure are filled with a material having a vaporization temperature that is less than the vaporization temperature of the support structure. Conductive structures are embedded in the support structure and the material, and a connective structure is mounted on the support structure. Finally, the material is removed from the interstices by heating the circuit assembly.

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