Inductor devices – With supporting and/or spacing means between coil and core – Preformed insulation between coil and core
Patent
1998-11-30
2000-12-05
Donovan, Lincoln
Inductor devices
With supporting and/or spacing means between coil and core
Preformed insulation between coil and core
336185, 336192, 336200, H01F 2730
Patent
active
061572845
ABSTRACT:
For packaging an electric circuit of the kind having a coil or coils in addition to electronic components such as transistors, diodes, and capacitors, a plastic molding is provided which comprises a bobbin with a pair of flanges on its opposite ends. The coils are wound on the bobbin and retained in position thereon by the flanges. The electronic components of the circuit, such as transistors and diodes, are all integrally embedded in one of the flanges and electrically connected to sheet-metal terminals which also are partly embedded in the same flange.
REFERENCES:
patent: 4760366 (1988-07-01), Mitsui
patent: 4939494 (1990-07-01), Masuda et al.
patent: 5034854 (1991-07-01), Matsumura et al.
Donovan Lincoln
Nguyen Tuyen T.
Sanken Electric Co. Ltd.
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