Packaging multiple dies on a ball grid array substrate

Details Packaging multiple dies on a ball grid array substrate Packaging multiple dies on a ball grid array substrate

1997-03-25

1998-09-29

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361760, 361762, 361764, 361765, 361715, 361787, 361761, 361803, 257778, 257779, 257780, 257782, 257781, 257783, 257784, 257786, 257787, 257773, 257774, 257777, 257686, H01L 2500

Patent

active

058153721

ABSTRACT:
An electrical arrangement including a circuitized substrate, the circuitized substrate having (i) a first substrate surface including a set of substrate contacts disposed thereon, and (ii) a second substrate surface including a set of input/output contacts disposed thereon. The electrical arrangement also includes a first die having (i) a first die surface including a set of first die contacts disposed thereon which is coupled to a first portion of the set of substrate contacts, and (ii) a second die surface configured to receive a second die. In the electrical arrangement, the set of substrate contacts includes a second portion of substrate contacts configured to be coupled to a set of second die contacts disposed on the second die and the circuitized substrate electrically interconnects the first portion and second portion of the set of substrate contacts and the set of input/output contacts to form a predetermined circuit.

REFERENCES:
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5477082 (1995-12-01), Buckley, III et al.
patent: 5502289 (1996-03-01), Takiar et al.
patent: 5608262 (1997-03-01), Degani et al.
patent: 5612513 (1997-03-01), Tuttle et al.
patent: 5646828 (1997-07-01), Degani et al.

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