Packaging module for a semiconductor wafer

Details Packaging module for a semiconductor wafer Packaging module for a semiconductor wafer

1984-07-03

1986-07-29

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

357 81, 361388, 361395, H05K 720

Patent

active

046033742

ABSTRACT:
A package for housing a semiconductor wafer includes a case having a plurality of thermal conductive pads disposed on an inner surface thereof for supporting the wafer. A printed circuit board is equipped with a plurality of contact pins and further includes a plurality of electrically conductive plastic pads which engage contact pads on the wafer when the printed circuit board is disposed on the wafer. The remainder of the cavity within the case is filled with a sealant such as epoxy. If desired, additional electronic components may be positioned on the printed circuit board.

REFERENCES:
patent: 3675089 (1972-07-01), Hantusch et al.
patent: 4000509 (1976-12-01), Jarvela
patent: 4283754 (1981-08-01), Parks
McBride, "Multifunction Plug for IC Package", IBM Technical Disclosure Bulletin, vol. 21, No. 9, 2/79, pp. 3594-3595.
Johnson, "Heat Sinks", IBM Technical Disclosure Bulletin, vol. 15, No. 6, 11/72, pp. 1950-1951.

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