Packaging method using thermoplastic materials and package obtai

Food or edible material: processes – compositions – and products – Packaged or wrapped product

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Details

53467, 53478, 53485, 2643281, 264544, 426129, 426392, B29C 4500, B29C 5100, B65B 728, B65D 8500

Patent

active

057441812

ABSTRACT:
The invention is a packaging method including providing a tray with heat-sealable rims; loading the tray with a product to be packaged; applying a lid on top of the tray, the tray rims and lid having contacting surfaces being made of materials which can be heat bonded to each other at a lid sealing station to effect sealing of the lid to the tray rims, the lid comprising a biaxially oriented heat-shrinkable film having a maximum shrink force, measured at the temperature in the lid sealing station during sealing, of 0.05 kg/cm in at least the transverse direction; and heat-sealing the lid to the tray rims. A modified atmosphere can be introduced between the lid and the tray. The invention is also a package including a product; a tray in which the product is placed, the tray having heat-sealable rims; and a lid heat-sealed to the tray rims, wherein the lid comprises a biaxially oriented heat-shrinkable film having a maximum shrink force of 0.05 kg/cm in at least the transverse direction.

REFERENCES:
patent: 3639318 (1972-02-01), Tijunelis et al.
patent: 4070852 (1978-01-01), Mitchell et al.
patent: 4345412 (1982-08-01), Balzer et al.
patent: 4357288 (1982-11-01), Oas et al.
patent: 4532189 (1985-07-01), Mueller
patent: 4548824 (1985-10-01), Mitchell et al.
patent: 4551380 (1985-11-01), Schoenberg
patent: 4617241 (1986-10-01), Mueller
patent: 4724185 (1988-02-01), Shah
patent: 4726984 (1988-02-01), Shah
patent: 4735855 (1988-04-01), Wofford et al.
patent: 4755419 (1988-07-01), Shah
patent: 4828928 (1989-05-01), Shah
patent: 4839235 (1989-06-01), Shah
patent: 4847148 (1989-07-01), Schirmer
patent: 4867336 (1989-09-01), Stewart
patent: 4886690 (1989-12-01), Davis et al.
patent: 4927677 (1990-05-01), Kasai
patent: 4935089 (1990-06-01), Schirmer
patent: 5004647 (1991-04-01), Shah
patent: 5118561 (1992-06-01), Gusavage et al.
patent: 5241030 (1993-08-01), Barry et al.
patent: 5350622 (1994-09-01), Speer et al.
patent: 5353985 (1994-10-01), Nageli et al.
patent: 5402622 (1995-04-01), Stockley, III et al.
patent: 5462756 (1995-10-01), Raines et al.
patent: 5520764 (1996-05-01), Toney et al.
patent: 5562958 (1996-10-01), Walton et al.
Abstract of Japan 54-100,896 (Published Aug. 8, 1979).

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