Packaging method of thin film passive components on silicon chip

Details Packaging method of thin film passive components on silicon chip Packaging method of thin film passive components on silicon chip

1999-09-20

2000-07-04

Bowers, Charles

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

438800, H01L 2166

Patent

active

060837667

ABSTRACT:
The present invention relates to a packaging method of thin film passive components on silicon chip, which employs ceramic or glass substrate to be mounted with the silicon chip so as to improve the mechanical strength of the components, and to a method of using thick film packaging technology to package the component. The cycle time of packaging is saved and the production cost is low.

REFERENCES:
patent: 4012579 (1977-03-01), Fox et al.
patent: 5355014 (1994-10-01), Rao et al.

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