Packaging method of temperature insensitive arrayed...

Details Packaging method of temperature insensitive arrayed... Packaging method of temperature insensitive arrayed...

2011-03-22

2011-03-22

Petkovsek, Daniel (Department: 2874)

Optical waveguides

With optical coupler

Input/output coupler

C385S024000, C156S256000

Reexamination Certificate

active

07912330

ABSTRACT:
The temperature dependency of center wavelength of AWG is compensated by adjusting optical input position by cutting interface between input slab waveguide of AWG and stripe waveguide circuit connected to input slab, followed by attaching lateral sliding rod which has larger Coefficient of Thermal Expansion than chip substrate. These cut-elements are passively re-aligned on the top surface of the alignment base substrate. The cut-element of AWG main body is adhered on alignment base substrate, and the cut-element of the strip waveguide circuit connected to the input slab is attached to the lateral sliding rod. The gap between the facets of re-aligned two cut-elements is maintained by inserting thin film followed by filling gap-fill material with no flowing nature to minimize degradation of optical characteristics and maintain free lateral movement between these two cut-elements.

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