Packaging method for light emitting diode module that...

Details Packaging method for light emitting diode module that... Packaging method for light emitting diode module that...

2011-04-05

2011-04-05

Smoot, Stephen W (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S029000, C257SE33059, C257SE33061

Reexamination Certificate

active

07919339

ABSTRACT:
A packaging method for light emitting diode module that includes fabricating frame around substrate, wherein the method comprises the steps of: fabricating a printed circuit layer with a plurality of staggered nodes on a substrate; fabricating a frame around the substrate; fabricating a protruding inclined pier around the bottom rim of the inner wall of the frame; fabricating a plurality of convex reflecting microstructure points on the surface of the printed circuit layer; positioning chips and wire bonding; spraying reflecting paint on the surface of the substrate and the inner wall of the frame except the chips; filling a silica gel diffusion layer formed by mixing the silica gel and the diffusion powder into the frame; and evenly coating a fluorescent glue layer formed by evenly mixing another silica gel and fluorescent powder on the silica gel diffusion layer.

REFERENCES:
patent: 6869813 (2005-03-01), Okazaki
patent: 2005/0087750 (2005-04-01), Braddell et al.
patent: 2006/0145172 (2006-07-01), Su et al.
patent: 2008/0042151 (2008-02-01), Oh et al.
patent: 2008/0203419 (2008-08-01), Harada

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