Packaging method for flip-chip type semiconductor device

Details Packaging method for flip-chip type semiconductor device Packaging method for flip-chip type semiconductor device

1992-09-22

1994-03-29

Cuda, Irene

Metal working

Method of mechanical manufacture

Electrical device making

29834, 2281791, B23K 3102

Patent

active

052973336

ABSTRACT:
In a packaging method for a flip-chip type semiconductor device, the method in which the rear surface sides of a plurality of semiconductor chips having solder bump electrodes on their front surfaces are fixed temporarily with an adhesive to the respective predetermined locations on the flat surface of a block, the block and a circuit board are positioned by placing the flat surface of the block opposed to the front surface of the circuit board where pads are formed, the solder bump electrodes and the pads are brought into contact by bringing them close to each other without the intermediary of soldering flux, and the plurality of semiconductor chips are bonded in a lump to the circuit board by welding the solder bump electrodes to the pads through reflowing of the solder of the solder bump electrodes by subjecting them to heat treatment.

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