Packaging method for a ball grid array integrated circuit withou

Details Packaging method for a ball grid array integrated circuit withou Packaging method for a ball grid array integrated circuit withou

1997-04-11

1998-11-03

Graybill, David

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

438612, 438613, 438614, 438615, 438616, 438617, 438977, H01L 2130, H01L 2146

Patent

active

058308008

ABSTRACT:
A packaging method for a ball grid array (BGA) integrated circuit (IC) without utilizing a base plate as a supporting plate, and therefore reducing the thickness of the packaged BGA IC. In the method, a copper sheet is used as a supporting plate first. After resin is applied to coat a chip implanted on the copper sheet and connecting wires thereof has hardened, the hardened resin is sufficiently firm to support the IC, so the copper sheet can be etched. Accordingly, a base plate is not necessary.

REFERENCES:
patent: 5620928 (1997-04-01), Lee et al.
patent: 5656550 (1997-08-01), Tsuji et al.

Affiliated with

Also associated with

Rating

Packaging method for a ball grid array integrated circuit withou does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packaging method for a ball grid array integrated circuit withou, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging method for a ball grid array integrated circuit withou will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-688753