Packaging method and package for edge-coupled optoelectronic dev

Coherent light generators – Particular component circuitry – Optical pumping

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357 74, 357 72, 357 17, 372 43, 372 55, H01L 3902

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active

049530062

ABSTRACT:
An edge-coupled optoelectronic device is mounted in a TO-style package which comprises a substrate assembly, a circular header and a cylindrical cap. A substrate and an insulating cover of the substrate assembly extend through an opening of the circular header and are secured in that opening. The optoelectronic device is secured to the substrate at a device support location. Electrical conductors are wire-bonded at contacts of the optoelectronic device and at corresponding device contacts of the substrate assembly to electrically connect the contacts of the optoelectronic device to respective conductors of the substrate assembly. The cylindrical cap is secured onto the header over the optoelectronic device.

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