Packaging means for a semiconductor die having particular shelf

Details Packaging means for a semiconductor die having particular shelf Packaging means for a semiconductor die having particular shelf

1991-02-13

1992-04-21

Hille, Rolf

357 68, H01L 2304, H01L 2306, H01L 2308

Patent

active

051073285

ABSTRACT:
A ceramic or plastic body has a shelf comprising conductive traces. A semiconductor die is attached to the underside of the shelf, or to a base of the body. A void or voids in said shelf allows the passage of bond wires to couple the bond pads of the inferiorly positioned semiconductor die with said conductive traces. Manufacturable from ceramic, plastic, or any workable material, various described embodiments of the invention alleviate the need for a lead frame while being usable with a die having bond pads located either centrally or laterally. The invention can receive die of various dimensions without a change of design while allowing short bond wire lengths for each die size.

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patent: 4926242 (1990-05-01), Itoh et al.
patent: 5032897 (1991-07-01), Mansuria et al.

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