Packaging materials

Details Packaging materials Packaging materials

1990-10-11

1992-01-21

Buffalow, Edith L.

Stock material or miscellaneous articles

Composite

Of addition polymer from unsaturated monomers

428516, B32B 2708

Patent

active

050827448

ABSTRACT:
A packaging material which comprises a pair of inflation film layers disposed symmetrically and joined through a pseudo-adhesive portion formed by blocking thereof.
In the packaging materials of the invention, a pair of inflation film layers is joined to each other by blocking in a flexible state to some degree without using adhesive. Therefore, they are not always joined completely integrally, and little space remains between the inflation film layers. The space can be increased by controlling the properties of the inflation film layers, blocking conditions and the like. By this pseudo-adhesion, physical strength such as tear strength is improved, buffer action is imparted and curling is prevented.

REFERENCES:
patent: 4701359 (1987-08-01), Akao
patent: 4778712 (1988-10-01), Akao
patent: 4778713 (1988-10-01), Akao
patent: 4784906 (1988-11-01), Akao
patent: 4787506 (1988-11-01), Akao
patent: 4796823 (1989-01-01), Akao et al.
patent: 4844961 (1989-07-01), Akao
patent: 4871613 (1989-10-01), Akao
patent: 4876125 (1989-10-01), Akao
patent: 4876129 (1989-10-01), Akao
patent: 4894264 (1990-01-01), Akao
patent: 4903834 (1990-02-01), Akao
patent: 4906517 (1990-03-01), Akao
patent: 4925711 (1990-05-01), Akao
patent: 4950512 (1990-08-01), Akao
patent: 4960626 (1990-10-01), Akao et al.
patent: 4977033 (1990-12-01), Akao
patent: 4978572 (1990-12-01), Akao

Affiliated with

Also associated with

Rating

Packaging materials does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packaging materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging materials will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-114898