Packaging material with an opening arrangement and a method of p

Details Packaging material with an opening arrangement and a method of p Packaging material with an opening arrangement and a method of p

1994-09-19

1997-04-15

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156250, 156256, 531331, 531333, 531335, 53412, 220265, 220269, 220359, B32B 3104, B65B 6120, B65D 4100

Patent

active

056205503

ABSTRACT:
A packaging material for producing packages includes a foundation layer that is provided with a through hole. A thermoplastic strip covers the through hole and an outer layer completely covers the thermoplastic strip and foundation layer. Various other layers can also be laminated to the foundation layer. When the thermoplastic strip is torn off, the various other layers accompany the thermoplastic strip, thereby exposing the through hole.

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