Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Including a second component containing structurally defined...
Patent
1989-10-02
1991-12-24
Seidleck, James J.
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Including a second component containing structurally defined...
428 352, 428516, B32B 530, B32B 2708
Patent
active
050751638
ABSTRACT:
A packaging material for photographic photosensitive material comprising a coextruded double layer film having a thickness of 30 to 150 .mu.m, containing 0.5 to 50 g/m.sup.2 of a light-shielding material, and consisting of a linear low-density polyethylene resin layer having a thickness of 30 to 70% of total thickness of the coextruded double layer film and comprising linear low-density polyethylene resin having a melt index of 0.1 to 10 g/10 minutes and a density of 0.870 to 0.939 g/cm.sup.3 and a high-density polyethylene resin layer comprising high-density polyethylene resin having a melt index of 0.1 to 5 g/10 minutes and a density of 0.950 to 0.970 g/cm.sup.3.
This packaging material is excellent in physical strength, particularly in Young's modulus, tensile strength, wear resistance and surface strength, and is suitable for a heavy material having a sharp edge.
REFERENCES:
patent: 4452846 (1984-06-01), Akao
patent: 4513050 (1985-04-01), Akao
patent: 4565720 (1986-01-01), Yaeo
patent: 4579781 (1986-04-01), Akao
patent: 4661395 (1987-04-01), Akao
patent: 4661401 (1987-04-01), Akao
patent: 4663218 (1987-05-01), Akao
patent: 4701359 (1987-10-01), Akao
Fuji Photo Film Co. , Ltd.
Seidleck James J.
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