Packaging material for photographic light-sensitive material...

Details Packaging material for photographic light-sensitive material... Packaging material for photographic light-sensitive material...

2006-08-08

2006-08-08

Schilling, Richard L. (Department: 1752)

Special receptacle or package

For plate or sheet

Fragile or sensitive

C206S524400, C206S524600, C428S521000, C428S522000, C428S523000, C524S190000, C524S202000, C524S204000, C524S403000, C524S408000, C524S413000, C524S228000, C430S496000, C430S501000

Reexamination Certificate

active

07086529

ABSTRACT:
There is provided a packaging material for a photographic light-sensitive material, the packaging material being formed from a resin composition that contains a compound having an unsaturated double bond or that contains a poly(conjugated diene) component, a metal ion that can promote a catalytic oxidation reaction of the unsaturated double bond and the poly(conjugated diene), and a chelating agent that can coordinate the metal ion in an amount sufficient to suppress the catalytic oxidation reaction. There is also provided a photographic light-sensitive material package formed by housing the photographic light-sensitive material in the packaging material for the photographic light-sensitive material.

REFERENCES:
patent: 4454270 (1984-06-01), Kolodchin et al.
patent: 5543270 (1996-08-01), Akao et al.
patent: 5827584 (1998-10-01), Akao et al.
patent: 583 778 (1994-02-01), None
patent: 6-67356 (1994-03-01), None
patent: 8-41288 (1996-02-01), None
patent: 2000-147716 (2000-05-01), None

Affiliated with

Also associated with

Rating

Packaging material for photographic light-sensitive material... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packaging material for photographic light-sensitive material..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging material for photographic light-sensitive material... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3604771