Packaging material and method of transporting honeycomb...

Special receptacle or package – Shock protection type – With article aperture in retainer

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C206S561000

Reexamination Certificate

active

08047377

ABSTRACT:
A packaging material of the present invention, which comprises a plate member, packages an object to be packaged by sandwiching the object, and the plate member is provided with an installation portion for the object to be packaged as well as a reinforcing portion.

REFERENCES:
patent: 5830548 (1998-11-01), Andersen et al.
patent: 5914187 (1999-06-01), Naruse et al.
patent: 6093460 (2000-07-01), Iwaya
patent: 6669751 (2003-12-01), Ohno et al.
patent: 7112233 (2006-09-01), Ohno et al.
patent: 7309370 (2007-12-01), Kudo et al.
patent: 7332014 (2008-02-01), Ono et al.
patent: 7341614 (2008-03-01), Hayashi et al.
patent: 7348049 (2008-03-01), Yoshida
patent: 7387829 (2008-06-01), Ohno et al.
patent: 7393376 (2008-07-01), Taoka et al.
patent: 7396586 (2008-07-01), Ohno et al.
patent: 7427308 (2008-09-01), Taoka et al.
patent: 7427309 (2008-09-01), Ohno et al.
patent: 7438967 (2008-10-01), Fujita
patent: 7449427 (2008-11-01), Ohno et al.
patent: 7462216 (2008-12-01), Kunieda et al.
patent: 7473465 (2009-01-01), Ohno et al.
patent: 2002/0033352 (2002-03-01), Levin et al.
patent: 2004/0161596 (2004-08-01), Taoka et al.
patent: 2005/0109023 (2005-05-01), Kudo et al.
patent: 2005/0153099 (2005-07-01), Yamada
patent: 2005/0169819 (2005-08-01), Shibata
patent: 2005/0175514 (2005-08-01), Ohno
patent: 2005/0180898 (2005-08-01), Yamada
patent: 2005/0247038 (2005-11-01), Takahashi
patent: 2005/0272602 (2005-12-01), Ninomiya
patent: 2006/0029897 (2006-02-01), Saijo et al.
patent: 2006/0029898 (2006-02-01), Saijo et al.
patent: 2006/0043652 (2006-03-01), Saijo et al.
patent: 2006/0051556 (2006-03-01), Ohno et al.
patent: 2006/0073970 (2006-04-01), Yamada
patent: 2006/0108347 (2006-05-01), Koyama et al.
patent: 2006/0118546 (2006-06-01), Saijp et al.
patent: 2006/0166820 (2006-07-01), Ogyu et al.
patent: 2006/0210765 (2006-09-01), Ohno et al.
patent: 2006/0216466 (2006-09-01), Yoshida
patent: 2006/0216467 (2006-09-01), Yoshida
patent: 2006/0222812 (2006-10-01), Koyama et al.
patent: 2006/0225390 (2006-10-01), Yoshida
patent: 2006/0230732 (2006-10-01), Kunieda
patent: 2006/0245465 (2006-11-01), Saijo et al.
patent: 2006/0269722 (2006-11-01), Yamada
patent: 2007/0020155 (2007-01-01), Ohno et al.
patent: 2007/0028575 (2007-02-01), Ohno et al.
patent: 2007/0044444 (2007-03-01), Oshimi
patent: 2007/0068128 (2007-03-01), Oshimi et al.
patent: 2007/0085233 (2007-04-01), Yamada
patent: 2007/0116908 (2007-05-01), Ohno et al.
patent: 2007/0126160 (2007-06-01), Takahashi
patent: 2007/0128405 (2007-06-01), Sakaguchi et al.
patent: 2007/0130897 (2007-06-01), Sakaguchi et al.
patent: 2007/0144561 (2007-06-01), Saijo et al.
patent: 2007/0148403 (2007-06-01), Yamamura et al.
patent: 2007/0152382 (2007-07-01), Yamada et al.
patent: 2007/0169453 (2007-07-01), Hayakawa
patent: 2007/0175060 (2007-08-01), Idei et al.
patent: 2007/0178275 (2007-08-01), Takahashi
patent: 2007/0187651 (2007-08-01), Naruse et al.
patent: 2007/0190350 (2007-08-01), Ohno et al.
patent: 2007/0196620 (2007-08-01), Ohno et al.
patent: 2007/0199205 (2007-08-01), Hoshino et al.
patent: 2007/0199643 (2007-08-01), Kawai et al.
patent: 2007/0202455 (2007-08-01), Saijo et al.
patent: 2007/0204580 (2007-09-01), Kunieda
patent: 2007/0212517 (2007-09-01), Ohno et al.
patent: 2007/0262498 (2007-11-01), Saijo et al.
patent: 2007/0293392 (2007-12-01), Ohno et al.
patent: 2008/0067725 (2008-03-01), Naruse et al.
patent: 2008/0084010 (2008-04-01), Naruse et al.
patent: 2008/0088072 (2008-04-01), Kobayashi
patent: 2008/0106008 (2008-05-01), Kasai et al.
patent: 2008/0106009 (2008-05-01), Naruse et al.
patent: 2008/0116200 (2008-05-01), Kawai et al.
patent: 2008/0120950 (2008-05-01), Ohno et al.
patent: 2008/0136053 (2008-06-01), Kuribayashi et al.
patent: 2008/0136062 (2008-06-01), Kasai et al.
patent: 2008/0138567 (2008-06-01), Ninomiya et al.
patent: 2008/0150200 (2008-06-01), Tajima
patent: 2008/0157445 (2008-07-01), Kawai et al.
patent: 2008/0174039 (2008-07-01), Saijo et al.
patent: 2008/0190081 (2008-08-01), Oshimi
patent: 2008/0190083 (2008-08-01), Oshimi
patent: 2008/0197544 (2008-08-01), Saijo et al.
patent: 2008/0213485 (2008-09-01), Shibata
patent: 2008/0236115 (2008-10-01), Sakashita
patent: 2008/0236122 (2008-10-01), Ito
patent: 2008/0236724 (2008-10-01), Higuchi
patent: 2008/0237942 (2008-10-01), Takamatsu
patent: 2008/0241015 (2008-10-01), Kudo et al.
patent: 2008/0241444 (2008-10-01), Oshimi
patent: 2008/0241466 (2008-10-01), Saito et al.
patent: 2008/0284067 (2008-11-01), Naruse et al.
patent: 2008/0305259 (2008-12-01), Saijo
patent: 2008/0318001 (2008-12-01), Sakakibara
patent: 2009/0004431 (2009-01-01), Ninomiya
patent: 2009/0107879 (2009-04-01), Otsuka et al.
patent: 2009/0130378 (2009-05-01), Imaeda et al.
patent: 2547822 (1977-04-01), None
patent: 8809724 (1988-09-01), None
patent: 102744 (1917-01-01), None
patent: 1500233 (1978-02-01), None
patent: 37-9298 (1962-05-01), None
patent: 59-010284 (1984-01-01), None
patent: 59-112778 (1984-07-01), None
patent: 62-174011 (1987-11-01), None
patent: 5-072777 (1993-10-01), None
patent: 2003-112771 (2003-04-01), None
patent: 2004-42964 (2004-02-01), None
patent: WO 97-41044 (1997-11-01), None
International Search Report issued to PCT/JP2006/303884 on Apr. 25, 2006.
Supplementary European Search Report issued to EP 0671500.1 on Jun. 5, 2007.
English translation of the International Preliminary Report on Patentability and the Written Opinion of the International Searching Authority for International Application No. PCT/JP2006/303884.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Packaging material and method of transporting honeycomb... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packaging material and method of transporting honeycomb..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging material and method of transporting honeycomb... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4273643

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.