Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-11-17
2000-02-22
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361764, 361765, 361772, 361820, 174250, 174259, 174260, 257684, 257782, 257783, 257735, 257784, 2502081, H05K 702
Patent
active
06028773&
ABSTRACT:
An integrated circuit package for direct mounting of an integrated circuit die to a printed circuit board is disclosed. The integrated circuit die includes a silicon sensor that detects changes in external variables, such as providing an image of a human fingerprint. The integrated circuit die has wire bond pads formed along only one side thereof to provide maximum exposure of the top surface area of the silicon sensor. The die is affixed to the printed circuit board and an adhesive surface coating, such as epoxy, is applied to the die and the printed circuit board for sealing the die thereto. The adhesive surface coating is formed from a first bead applied to the printed circuit board to cover at least the ends of the wires bonded to the board and a second bead applied to the first bead and the die to enclose the sides of the die and partially overlap the wire band pads and wires on top surface thereof.
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Carlson David V.
Foster David
Galanthay Theodore E.
Jorgenson Lisa K.
Picard Leo P.
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