Packaging for semiconductors

Details Packaging for semiconductors Packaging for semiconductors

1992-12-15

1994-02-15

Michl, Paul R.

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

26427217, 5253261, 525338, 526281, 526284, 427 58, 428457, B29C 4514, C08F23200

Patent

active

052864391

ABSTRACT:
Semiconductor chips are packaged by injection molding while continuously feeding a lead frame, characterized by using for the injection molding a hydrogenated polymer (A) obtained by the hydrogenation of a polymer obtained by ring-opening polymerization of a specific norbornene derivative or a monomer mixture comprising said norbornene derivative and other monomer copolymerizable therewith, wherein said injection molding for the packaging is carried out under the conditions of a resin temperature in the range of 280.degree. C. to 360.degree. C.; the molding temperature in the range of Tg -80.degree. C. to Tg +10.degree. C., wherein Tg is the glass transition temperature of the hydrogenated polymer (A) is Tg; and the injection pressure in the range of 10 to 200 kgf/cm.sup.2.

REFERENCES:
patent: 5164469 (1992-11-01), Goto et al.

Affiliated with

Also associated with

Rating

Packaging for semiconductors does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packaging for semiconductors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging for semiconductors will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1204730