Packaging for semiconductor logic devices

Details Packaging for semiconductor logic devices Packaging for semiconductor logic devices

1991-01-22

1992-08-11

Mintel, William

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 71, 357 79, 357 68, 361397, 174 524, 395800, H01L 2302

Patent

active

051384345

ABSTRACT:
A logic module design is disclosed which incorporates an unencapsulated wafer section or sections. The disclosed module is an improvement over previous designs in that it is less expensive and easier to manufacture due to the reduced number of components and the complexity of the components, is faster and consumes less power because of its shorter trace lengths and smaller size, and is more reliable as a result of its greatly reduced number of interconnects.

REFERENCES:
patent: 4855809 (1989-08-01), Malhi et al.
patent: 4899107 (1990-02-01), Corbett et al.
patent: 4922378 (1990-05-01), Malhi et al.
patent: 4949163 (1990-08-01), Sudo et al.
patent: 4967262 (1990-10-01), Farnsworth
patent: 4975763 (1990-12-01), Baudouin et al.
patent: 5020999 (1991-06-01), Dewitt et al.

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