Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor
Patent
1991-01-22
1992-08-11
Mintel, William
Electricity: electrical systems and devices
Safety and protection of systems and devices
With specific current responsive fault sensor
357 71, 357 79, 357 68, 361397, 174 524, 395800, H01L 2302
Patent
active
051384345
ABSTRACT:
A logic module design is disclosed which incorporates an unencapsulated wafer section or sections. The disclosed module is an improvement over previous designs in that it is less expensive and easier to manufacture due to the reduced number of components and the complexity of the components, is faster and consumes less power because of its shorter trace lengths and smaller size, and is more reliable as a result of its greatly reduced number of interconnects.
REFERENCES:
patent: 4855809 (1989-08-01), Malhi et al.
patent: 4899107 (1990-02-01), Corbett et al.
patent: 4922378 (1990-05-01), Malhi et al.
patent: 4949163 (1990-08-01), Sudo et al.
patent: 4967262 (1990-10-01), Farnsworth
patent: 4975763 (1990-12-01), Baudouin et al.
patent: 5020999 (1991-06-01), Dewitt et al.
Corbett Tim J.
Wood Alan G.
Micro)n Technology, Inc.
Mintel William
Potter Roy
Protigal Stanley N.
LandOfFree
Packaging for semiconductor logic devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Packaging for semiconductor logic devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging for semiconductor logic devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-350977