Packaging for semiconductor laser device and method for...

Details Packaging for semiconductor laser device and method for... Packaging for semiconductor laser device and method for...

2006-04-25

2006-04-25

Harvey, Minsun (Department: 2828)

Coherent light generators

Particular temperature control

Heat sink

C372S109000, C257S100000, C257S710000

Reexamination Certificate

active

07035301

ABSTRACT:
In a semiconductor laser device, a flange (33) of a cap (32) is provided with straight-line cut-off portions (34) that are the same in number as notches (36, 37) of a stem (35). With the cut-off portions (34) positioned so as not to overlap the notches (36, 37) of the stem (35) in position, welding between the cap (32) and the stem (35) is performed. The cut-off portions (34) of the cap (32) secure obtainment of a reference plane38with a large area in a place where the notches (36, 37) of the stem (35) are absent. As a result, sufficient precision in optical characteristics can be secured while suppressing an influence of unevenness of the stem (35) having a small diameter on a deviation angle θ of an optical axis from a normal line to a reference plane of an optical pickup.

REFERENCES:
patent: 5052009 (1991-09-01), Tsuboi et al.
patent: 2004/0240499 (2004-12-01), Tsuji
patent: 2005/0089070 (2005-04-01), Honda
patent: 9-186406 (1997-07-01), None
patent: 2000-252575 (2000-09-01), None

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