Packaging for populated circuit boards

Details Packaging for populated circuit boards Packaging for populated circuit boards

1991-10-21

1993-03-23

Coan, James F.

Package making

Methods

Conforming by stretching or shrinking of cover over contents

53412, 53472, 206328, B65B 5302, B65B 5500

Patent

active

051953021

ABSTRACT:
A package system for populated circuit boards is disclosed. The circuit board is placed on a piece of conductive paperboard and is shrink wrapped with an antistatic film, which may be provided with a tearstrip. Placed on a cardboard carton, the package provides good protection against physical shocks, vibration and electrostatic discharge.

REFERENCES:
patent: 3756399 (1973-09-01), Cosier et al.
patent: 3906702 (1975-09-01), Yano
patent: 4707414 (1987-11-01), Long et al.
patent: 4823945 (1989-04-01), Adelman
patent: 5033253 (1991-07-01), Havens et al.
patent: 5072574 (1991-12-01), Puett
Cryovac EPD-512 Film Description, 2 pages.
Protech Specification Sheet, 1 page.
Film Protects Circuit Boards In Three Ways, "Packaging" magazine, May 1990, Cahners Publishing Company, 1 page.

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