Packaging for multiple chips on a single leadframe

Details Packaging for multiple chips on a single leadframe Packaging for multiple chips on a single leadframe

1989-01-23

1992-01-28

James, Andrew J.

357 80, 357 65, H01L 2348

Patent

active

050847538

ABSTRACT:
The foregoing objects are achieved in an assembly wherein the die attach paddle of a conventional leadframe is cut to form two electrically isolated die attach paddles and a dielectric tape is applied to one side of the two die attach paddles, spanning the space between them, providing physical support and substantially preventing cantilevered or twisting motion of the die attach paddles relative to the remainder of the leadframe assembly.

REFERENCES:
patent: 3938177 (1976-02-01), Hansen et al.
patent: 3978516 (1976-08-01), Noe
patent: 4089733 (1978-05-01), Zimmerman
patent: 4203792 (1980-05-01), Thompson
patent: 4264917 (1981-04-01), Ugon
patent: 4282544 (1981-08-01), Nowak
patent: 4331831 (1982-05-01), Ingram et al.
patent: 4450461 (1984-05-01), Cook et al.
patent: 4532538 (1985-07-01), Wurz
patent: 4794431 (1988-12-01), Park
patent: 4878106 (1989-10-01), Sachs

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