Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent
1990-04-24
1992-12-08
Picard, Leo P.
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
361408, 361417, 361419, 361420, 361212, 361421, 174 524, 257668, H05K 100
Patent
active
051703289
ABSTRACT:
A package is provided for connecting a plurality of molded carriers each having an integrated circuit which has been previously bonded to the electrical leads of a TAB tape. The package flexibly and sequentially connects a plurality of the carriers, so as to form a flexible and continuous chain of the carriers. The package preferably utilizes a flexible conductive tape which is continuously provided on parallel ends, or edges, of each carrier, so as to link the plurality of carriers together. The package permits continuous feeding of the carriers into subsequent test and assembly machines utilized to attach the integrated circuit to a printed circuit board.
REFERENCES:
patent: 3766439 (1973-10-01), Isaacson
patent: 4562924 (1986-01-01), Okamoto
patent: 4617605 (1986-10-01), Obrecht et al.
patent: 4928206 (1990-05-01), Porter et al.
DE-A-1 486 312 (Ets Krieg & Zivy) * p. 5, paragraphs 1,2; p. 6, paragraph 2; FIGS. 1,3,5 *-No Translation.
GB-A-1 399 358 (Rowe International) * p. 2, lines 23-29,79-82; FIG. 1 *-No Translation.
DE-U-8 713 163 (Siemens) * p. 2, lines 1-7; p. 2, line 37-p. 3, line 7 *-No Translation.
Elektronik vol. 30, No. 21, Oct. 1981, pp. 104-110, Munchen, DE; R. Hecker: "Gegurtete Bauelemente fur die automatische Bestuckung" * p. 107, left-hand column, last paragraph-p. 108, left-hand column, last paragraph; FIG. 7 *-No Translation.
European Search Report on European Application No. EP 89 30 6821 dated Jul. 1, 1991.
Annex to the European Search Report on European Application No. EP 91 20 0788.
Brooks Cary W.
Delco Electronics Corporation
Ghosh Paramita
Picard Leo P.
LandOfFree
Packaging for molded carriers of integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Packaging for molded carriers of integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging for molded carriers of integrated circuits will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-964592