Packaging for high power pump laser modules

Details Packaging for high power pump laser modules Packaging for high power pump laser modules

2005-01-25

2005-01-25

Mayo, III, William H. (Department: 2831)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C385S090000, C385S091000

Reexamination Certificate

active

06846113

ABSTRACT:
Locally heated low temperature solder glass is used to permanently fix an optical fiber with sub-micron precision to a glass ceramic submount inside a high power pump laser module. The fiber is manipulated into a predetermined alignment while the solder glass is still molten and the solder glass is then cooled to its solidified state. The predetermined alignment may include an offset to compensate for subsequent thermally related dimensional changes as the solder glass cools and solidifies. If necessary, the solder glass can be remelted and the fiber realigned with a different offset if the first alignment attempt is less than optimal. This alignment process has been demonstrated to provide reliable and efficient coupling of an optical fiber to a high power pump laser within very tight tolerances. A similar process can also be applied to other micro-optics assemblies where high precision, high reliability fiber fixing is required.

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patent: 20040037519 (2004-02-01), Kilian

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