Packaging for electronic circuits using a capacitor as a structu

Details Packaging for electronic circuits using a capacitor as a structu Packaging for electronic circuits using a capacitor as a structu

1996-03-27

1997-08-19

Picard, Leo P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

3613011, 361520, 361535, 361538, 174 35R, 174 35TS, H01G 400

Patent

active

056594550

ABSTRACT:
A package for electronic circuits can be made using a bottom plate, a top plate, and side walls which are stick capacitors. The top and bottom plates can be used as two of the terminations for the electronic circuit to provide a low impedance connection for heavy currents. The contact areas of the stick capacitor are bonded to the top and bottom plates, such as by reflow soldering. The top and bottom plates and the stick capacitor side walls provide a completely enclosed equivalent of a Faraday shield for superior EMI enclosure. Although the top and bottom are isolated electrically at DC by the dielectric layers of the capacitor, they are effectively short circuited at higher AC frequency. The stick capacitors can be drilled through to provide for additional conductors to the electronic circuit. In another embodiment of the invention, a stiffener for a printed circuit board comprises a stick capacitor as a filler for a laminated beam in which the top and bottom stress members are conductors.

REFERENCES:
patent: 3098955 (1963-07-01), Davis et al.
patent: 3426257 (1969-02-01), Youngquist
patent: 4833276 (1989-05-01), Ito
patent: 5057648 (1991-10-01), Blough et al.
patent: 5223672 (1993-06-01), Pinneo et al.
patent: 5433110 (1995-07-01), Gertz et al.

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