Semiconductor device manufacturing: process – Semiconductor substrate dicing – With attachment to temporary support or carrier
Patent
1997-06-30
1999-11-02
Niebling, John F.
Semiconductor device manufacturing: process
Semiconductor substrate dicing
With attachment to temporary support or carrier
438106, 438113, 438118, 156247, 156344, 1562722, 1563796, H01L 21301, H01L 2146, H01L 2178
Patent
active
059769556
ABSTRACT:
A structure and method for protecting semiconductor integrated microcircuit dice during shipping. The structure secures the position of the die or dice atop an EMR-penetrable element using an adhesive layer, the stickiness, adhesiveness or coefficient of friction of which is alterable by exposure to EMR of a predetermined wavelength range, such as ultraviolet light. Once the structure reaches its destination, prior to removal of the dice, the adhesive layer is exposed to EMR, such as ultraviolet light, through the element. This exposure reduces the stickiness, adhesiveness, or coefficient of friction of the adhesive to facilitate die removal. The EMR-sensitive adhesive does not leave contaminating silicon residue on the removed die. The invention may be realized using currently commercially available UV tape and modified die-pac designs having UV light penetrable die transport portions, or tape-and-reel type die transport structures.
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Micro)n Technology, Inc.
Niebling John F.
Zarneke David A.
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