Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Junction field effect transistor
Reexamination Certificate
2008-01-24
2010-10-19
Louie, Wai-Sing (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Junction field effect transistor
C257S432000, C257S434000, C257S440000, C257S443000, C257SE29234
Reexamination Certificate
active
07816710
ABSTRACT:
A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.
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Chui Clarence
Cummings William J.
Gally Brian J.
Kothari Manish
Palmateer Lauren
Knobbe Martens Olson & Bear LLP
Louie Wai-Sing
QUALCOMM MEMS Technologies Inc.
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