Packaging for an interferometric modulator

Details Packaging for an interferometric modulator Packaging for an interferometric modulator

2007-01-16

2007-01-16

Schwartz, Jordan (Department: 2873)

Optical: systems and elements

Optical modulator

Light wave temporal modulation

C359S247000, C359S259000

Reexamination Certificate

active

10844819

ABSTRACT:
A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package

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