Packaging food in raised state

Package making – Methods – Forming or partial forming a receptacle and subsequent filling

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

53471, 53486, B65B 4700, B65B 4710

Patent

active

047964111

ABSTRACT:
A method of packaging food in raised state, comprising the steps of forming a displaceable wall portion integrally with and in the central section of a bottom wall of a food container so that the wall portion can be projected into and out of the container when the wall portion is pressed inward and outward, inserting a food in the container with the wall portion kept projecting outward, sealing the container with a film, and pressing the wall portion so as to be projected into the container and thereby raise the food above the plane of the upper end of the container against the tension of the film. Since the food is placed in the container with the displaceable wall portion kept projecting outward, the falling of the food during the food packing operation can be prevented. When the displaceable wall portion of the food-packed and sealed container is pressed inward to raise the food, a recess occurs in the lower surface of the container, which recess enables the container to be piled stably on the raised surface of another similar food-packed container.

REFERENCES:
patent: 3104506 (1963-09-01), Rohdin
patent: 3353325 (1967-11-01), Jensen et al.
patent: 3483908 (1969-12-01), Donovan
patent: 3492773 (1970-02-01), Bergstrom
patent: 3521422 (1970-07-01), Tabor

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Packaging food in raised state does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packaging food in raised state, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging food in raised state will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2101488

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.