Packaging electrical components

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

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Details

174 505, 174 522, 361728, H05K 114

Patent

active

055262341

ABSTRACT:
A package for electrical components in which a circuit board holds the components. The package includes an enclosure having generally parallel, spaced apart upper and lower internal surfaces. The circuit board lies generally parallel to the lower internal surface with the electrical components held in an internal-space between the circuit board and the upper internal surface. Conductive terminal pins extend from outside the enclosure into the internal space. The terminal pins are connected to the circuit board by conductive links, each link having an end attached to the periphery of the circuit board and another end projecting into the internal space.
In other aspects, a resilient non-compressive encapsulant is used to fill a space within the package; an electronic component is mounted with a power-dissipating device sitting in the aperture of a circuit board, a power-dissipating surface in contact with a baseplate, and contact pads electrically connected to the circuit board; terminal pins are connected to a circuit board using a fence connected at the periphery of the circuit board, the fence extending substantially perpendicularly to the circuit board, the fence comprising at least two conductive links joined by a severable junction.

REFERENCES:
patent: 3621338 (1971-11-01), Rogers et al.
patent: 3683241 (1972-08-01), Duncan
patent: 3737729 (1973-06-01), Carney
patent: 4218725 (1980-08-01), Kaufman
patent: 4400762 (1983-08-01), Bartley et al.
patent: 4417296 (1983-11-01), Schelhorn
patent: 4531145 (1985-07-01), Wiech, Jr.
patent: 4551746 (1985-11-01), Gilbert et al.
patent: 4551747 (1985-11-01), Gilbert et al.
patent: 4554613 (1985-11-01), Kaufman
patent: 4724283 (1988-02-01), Shimada et al.
patent: 4740414 (1988-04-01), Shaheen
patent: 4750089 (1988-06-01), Derryberry et al.
patent: 4769525 (1988-09-01), Leatham
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4783697 (1988-11-01), Benenati et al.
patent: 4840286 (1989-06-01), Heberling et al.
patent: 4847136 (1989-07-01), Lo
patent: 4872081 (1989-10-01), Murphy et al.
patent: 4879630 (1989-11-01), Boucard et al.
patent: 4899257 (1990-02-01), Yamamoto
patent: 4918811 (1990-04-01), Eichelberger et al.
patent: 4953005 (1990-08-01), Carlson et al.
patent: 4994215 (1991-02-01), Wiech, Jr.
patent: 5001603 (1991-03-01), Villanenva, III et al.
patent: 5006673 (1991-04-01), Freyman et al.
patent: 5019941 (1991-05-01), Craft
patent: 5019946 (1991-05-01), Eichelberger et al.
patent: 5028987 (1991-07-01), Neugebauer et al.
patent: 5111362 (1992-05-01), Flamm et al.
patent: 5258888 (1993-11-01), Korinsky
Gates and Yokoro; "Sealed Chip-On-Board Circuit Protection"; 3rd International SAMPE Electronics Conference; Jun. 20-22, 1989; pp. 929-938.

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