Packaging curable materials

Details Packaging curable materials Packaging curable materials

1993-06-02

1994-09-20

Sewell, Paul T.

Special receptacle or package

For a tool

Body treatment

206368, 206562, 206564, 206 635, B65D 8310

Patent

active

053481542

ABSTRACT:
An article includs a) a tray having at least two holes; b) at least two substrates each having a top surface and a single well opening only at the top surface and being removably retained in one of the holes in the tray; c) a lid releasably attached to the top surface so as to cover the well opening in a manner such that the substrate is removable from the hole with the lid attached to the top surface thereof; d) an orthodontic appliance having a tacky substance on an exterior surface thereof that is positioned in the well such that the tacky substance does not separate from the appliance upon removal from the well.

REFERENCES:
patent: 3343669 (1967-09-01), Loran
patent: 3620988 (1971-11-01), Cohen
patent: 3691140 (1972-09-01), Silver
patent: 3924748 (1975-12-01), Braverman
patent: 4055672 (1977-10-01), Hirsch et al.
patent: 4204325 (1980-05-01), Kaelble
patent: 4251712 (1981-02-01), Parr
patent: 4355721 (1982-10-01), Knott, II et al.
patent: 4416375 (1983-11-01), Braverman et al.
patent: 4537305 (1985-08-01), Takanashi
patent: 4587152 (1986-05-01), Gleichenhagen et al.
patent: 4645783 (1987-02-01), Kinoshita
patent: 4656218 (1987-04-01), Kinoshita
patent: 4735318 (1988-04-01), Keffeler
patent: 4735837 (1988-04-01), Miyasaka et al.
patent: 4749352 (1988-06-01), Nicholson
patent: 4786696 (1988-11-01), Bohnel
patent: 4848066 (1989-07-01), Luhman
patent: 4856857 (1989-08-01), Takeuchi et al.
patent: 4898276 (1990-02-01), Georgakis
patent: 4977003 (1990-12-01), Brown et al.
patent: 4978007 (1990-12-01), Jacobs et al.
patent: 5139188 (1992-08-01), Scharf
patent: 5172809 (1992-12-01), Jacobs et al.

Affiliated with

Also associated with

Rating

Packaging curable materials does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packaging curable materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging curable materials will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2429092