Packaging curable materials

Details Packaging curable materials Packaging curable materials

1990-11-20

1992-12-22

Sewell, Paul T.

Special receptacle or package

For a tool

Body treatment

206 635, 206460, 206564, B65D 8310

Patent

active

051728095

ABSTRACT:
Disclosed is a packaged element containing a) a substrate that transmits less than about 0.5% of actinic radiation and has at least one recess, b) a cover that transmits less than about 0.5% of actinic radiation and transmits at least part of the visible light spectrum, c) a structure for maintaining the cover in contact with the substrate such that the cover filters incident radiation entering the recess, and d) an element located in the recess and having a substance thereon that is curable by exposure to the actinic radiation. Also disclosed is an article containing a) a substrate having at least one recess with an interior surface, b) an element having a tacky substance on a surface thereof, and c) a structure for positioning the element inside the recess such that the tacky substance does not separate from the element upon removal from the recess.

REFERENCES:
patent: 3212913 (1965-10-01), MacKenzie
patent: 3265202 (1966-08-01), Cornell
patent: 3509991 (1970-05-01), Hurst
patent: 3692469 (1972-09-01), Peace
patent: 3797115 (1974-03-01), Silverman et al.
patent: 4078662 (1978-03-01), Volland
patent: 4094068 (1978-06-01), Schinhammer
patent: 4117596 (1978-10-01), Wallshein
patent: 4136777 (1979-01-01), Watts, Jr.
patent: 4204325 (1980-05-01), Kaelble
patent: 4251712 (1981-02-01), Parr
patent: 4489487 (1984-12-01), Bura
patent: 4749352 (1988-06-01), Nicholson
patent: 4844246 (1989-07-01), Harrison et al.
patent: 4898276 (1990-02-01), Georgakis
patent: 4948367 (1990-08-01), Haas
patent: 4978007 (1990-12-01), Jacobs et al.
patent: 4979611 (1990-12-01), Bolliger et al.

Affiliated with

Also associated with

Rating

Packaging curable materials does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packaging curable materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging curable materials will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-970930