Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1990-03-12
1994-05-24
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361785, 361790, 439 66, 439 74, H05K 720, H05K 114
Patent
active
053154819
ABSTRACT:
The present invention resides in a packaging construction for removably mounting and interconnecting semiconductor wafers with minimized interconnection lead lengths between the wafers and with a high packing density. The wafer packaging construction includes a multilayer printed circuit board, an insulating board interposed between each wafer and the circuit board and upper and lower housing sections. Electrical connections between contact areas on each semiconductor wafer and the multilayer circuit board are established by compressing the housing sections together, thus compressing wadded-wire connector elements positioned in openings of the insulating boards against the wafer contact areas and the multilayer circuit board contact areas. The novel construction of the invention eliminates the need for soldering, removes the interconnect inductance of the fine wires used in conventional packaging constructions, dramatically increases the number of wafers that can be mounted on a single multilayer circuit board, and substantially reduces signal propagation time between circuits.
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Taylor Ronald L.
Thompson Gregory D.
TRW Inc.
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