Packaging combination

Details Packaging combination Packaging combination

1987-09-22

1988-12-13

Van Balen, William J.

Special receptacle or package

For a building component

Shingle

53450, 53463, 206225, 428215, 4283155, 4283159, B65D 6900, B65D 7302, B32B 326

Patent

active

047904330

ABSTRACT:
Integrated circuit with leads extending essentially in one direction is packaged by pushing it against layer of crisp foam that can be electrically conductive, to cause the leads to penetrate into the foam. The integrated circuit is then covered with a plastic film that is adhered to the foam around the integrated circuit. Anti-stat coatings are applied on the various surfaces, and plastic film can be metallized.

REFERENCES:
patent: 3653498 (1972-04-01), Kisor
patent: 4321297 (1982-03-01), Adelman
patent: 4584225 (1986-04-01), Adelman
patent: 4601157 (1986-07-01), Adelman
patent: 4693056 (1987-09-01), Raszewski
patent: 4698254 (1987-10-01), Raszewski

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