Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
Patent
1996-10-28
1998-03-31
Lee, John D.
Optical waveguides
With disengagable mechanical connector
Optical fiber to a nonfiber optical device connector
359619, 372 50, G02B 642
Patent
active
057347719
ABSTRACT:
An optical subassembly comprises a two-dimensional semiconductor laser array having a plurality of laser diodes arranged in rows and columns. The laser diodes are configured to provide laser lights at a first and a second direction. A first lenslet module is disposed adjacent the semiconductor laser array, such that light emitted from the laser array in the first direction is collected by the lenslet module. The lenslet module is further configured to focus the collected light at a given first focal point that may be disposed on a receiving end of a fiber optic. A second lenslet module is disposed adjacent the semiconductor laser array, such that light emitted from the laser array in the second direction is collected by the second lenslet module. The second lenslet module is further configured to focus said collected light at a given second focal point disposed at the receiving end of a photodetector.
REFERENCES:
patent: 4740259 (1988-04-01), Heinen
patent: 4826269 (1989-05-01), Streifer et al.
patent: 4994664 (1991-02-01), Veldkamp
patent: 5369659 (1994-11-01), Furumoto et al.
patent: 5463610 (1995-10-01), Nishikawa
patent: 5481629 (1996-01-01), Tabuchi
patent: 5500869 (1996-03-01), Yoshida et al.
Lee John D.
Lucent Technologies - Inc.
LandOfFree
Packaging assembly for a laser array module does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Packaging assembly for a laser array module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging assembly for a laser array module will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-58476