Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-12-08
1998-10-20
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257667, 257675, 26427211, 361813, 438122, H05K 720
Patent
active
058256237
ABSTRACT:
Encapsulated thermally enhanced (TE) and electrically and thermally enhanced (ETE) integrated circuit assemblies that include bulky thermally conductive heat sinks are disclosed. The integrated circuit assemblies are configured to prevent the formation of pinholes and IC package warpage without adding bulk or additional structures. The assemblies are repositioned, through an offset in the bonding fingers of the leadframe, so that the rates of mold flow in the two halves of the mold cavity are substantially balanced. The repositioning of the assemblies also substantially balances the amount of mold material in the mold halves, which prevents warpage in a finished IC package.
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patent: 5379187 (1995-01-01), Lee
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patent: 5483740 (1996-01-01), Maslakow
patent: 5629561 (1997-05-01), Shin
Chen Che-Yuan
Lee Sang S.
Tolin Gerald P.
VLSI Technology Inc.
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