Packaging arrangements for items to be subsequently mounted

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156 63, 156 71, 156247, 423111, 42385, B32B 3100

Patent

active

052521664

ABSTRACT:
A packaging arrangement for items to be subsequently mounted, having a pair of plastic sheets with dimensions that are greater than the item. One sheet includes an adhesive layer that adheres to the front face of the item and also adheres to portions of the other sheet so that the item is captured in between. The sheet with the adhesive layer is preferably transparent. When mounting, the sheets are separated, a mounting adhesive is applied to the back face of the item, and thereafter both the adhesive layer and the back face are urged against the mounting surface. The sheet temporarily maintains the item mounted until the mounting adhesive hardens and the sheet is thereafter removed. The item can a single unit, or a plurality of loose units, or a plurality of units attached to a backing. If a single unit or a plurality of pre-connected units, the packaging arrangement need not attach to the entire item. Guides in the form of lines or holes are provided as a means to aid in aligning the item in the mounting process. If a large design is to be created, the packaging arrangement can include a plurality of partial packaged items for mounting adjacent each other to create the composite design. In addition, the partial packaged items can be mounted on top of each other to create a three dimensional design.

REFERENCES:
patent: 2680319 (1954-06-01), Dratler
patent: 3785912 (1974-01-01), Van Deusen
patent: 4612755 (1986-09-01), Cavanagh
patent: 4844757 (1989-07-01), Nagata et al.
patent: 4889572 (1989-12-01), Danico et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Packaging arrangements for items to be subsequently mounted does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packaging arrangements for items to be subsequently mounted, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging arrangements for items to be subsequently mounted will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1901598

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.